| 摘要 |
PROBLEM TO BE SOLVED: To obtain a reflow furnace that can accurately measure the temperature at a prescribed positions of all electronic circuit substrates within the furnace for the purpose of soldering under a correct temperature profile. SOLUTION: A reflow furnace 1A is provided at the upper part of a furnace wall 7 of one of preheat zone Hp or reflow zone Hr or both of these walls, with an electronic circuit substrate detector 13 that can detect the position of a electronic circuit substrate Bt which is transferred within the furnace and a noncontact thermometer 14 that can measure the temperature of the predetermined positions of the electronic circuit substrate Bt on noncontact basis. The noncontact thermometer 14 is provided on the upstream side of the transfer direction by providing a prescribed interval with the electronic circuit substrate detector 13 in a mechanism of sliding in the transfer direction with respect to the electronic circuit substrate detector 13.
|
