发明名称 MANUFACTURE OF OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE
摘要 PROBLEM TO BE SOLVED: To remove a nickel oxide film deposited on the surface of a gold plating layer so as to improve a brazing material in bonding strength to a metal fixing member and mount the metal fixing member on a base body firmly by brazing, by a method wherein a nickel plating layer deposited on the surface of a metal fixing member is made to contain a specific wt.% cobalt. SOLUTION: A nickel plating layer 12 and a gold plating layer 13 are successively deposited on the surface of a cylindrical metal fixing member 8 so as to mount the fixing member 8 surely and firmly on a base body 1 by brazing. As 1 to 65 wt.% cobalt is contained in the nickel plating layer 12, a part of the nickel plating layer 12 deposited on the metal fixing member 8 can be prevented from diffusing into the gold plating layer 13 due to heat of glass sealing and atmosphere in a following process. Then, a light transmission member 9 is fixed inside the metal fixing member 8 through the intermediary of a glass 14 so as to stop up the inside of the metal fixing member 8. The metal fixing member 8 is mounted on a metal layer previously deposited around a through-hole 1b bored in the base body 1 by brazing through the intermediary of a brazing material 15.
申请公布号 JP2000277643(A) 申请公布日期 2000.10.06
申请号 JP19990080522 申请日期 1999.03.24
申请人 KYOCERA CORP 发明人 SAWAI TAKASHI
分类号 H01L23/02;H01L31/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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