| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup element which attains miniaturization and cost reduction by mounting it on another package, since a ceramic package with an outer lead is generally expensive and difficult to miniaturize, and top prevent deterioration of the solid-state image pickup element by reducing the temperature for adhesion. SOLUTION: A solid-state image pickup element chip 1 is mounted on the surface of a leafless chip carrier 12 on whose back face is provided with extended metallic wiring, and an anisotropy conductive film 15 is applied to the back face of the leadless chip carrier 12 and adhered to a circuit board through thermocompression bonding. Thus, miniaturization can be realized, and the solid-state image pickup element can be mounted through relatively low temperature thermocompression bonding.
|
