| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductor paste capable of forming a fine and thick film conductor pattern having high adhesion to a circuit board, and having excellent preservative stability by suppressing gelation. SOLUTION: This conductor paste is made by mixing an organic binder having an acid functional group, inorganic powder comprising glass and/or ceramic and conductive metal powder, and at least either one of the inorganic powder or the conductive metal powder contains polyvalent metal. The conductor paste contains monoal compound with a boiling point of not less than 78 deg.C.</p> |
