| 摘要 |
PROBLEM TO BE SOLVED: To obtain a flexible printed board with contact which can attain bonds with a high connect reliability with fine terminals containing Au at least in the surface portions, including bonds with terminals of a suspension board with circuits in a hard disc drive. SOLUTION: A conductive pattern 2 is provided in an insulator layer 1, and bump contacts 3 are provided at positions corresponding to outer terminals on one surface 1a of the insulator layer 1 and connected to the inner conductor pattern 2 through conductive paths 4. An Au layer 3a is provided on the surfaces of the bump contacts 3. Openings 5 are formed at positions corresponding to the contacts 3 at the back sides into the other surface 1b of the insulator layer 1, thereby exposing the conductor pattern 2 in the openings 5. The opening 5 is used as a bonding ultrasonic wave injection hole, to thereby obtain a good bond state with an Au-plated terminal of an object.
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