| 摘要 |
PROBLEM TO BE SOLVED: To improve a fire resistance, etc., of an inter-layer insulating adhesive for multilayer interconnection board by comprising a sulfur containing amorphous thermo-plastic resin, weight-average molecular weight in specified range of sulfur containing epoxy resin, multifunctional epoxy resin of epoxy equivalent to a specific value or less, epoxy settling agent, and phosphorus containing compound agent. SOLUTION: An interlayer insulating adhesive for multilayer interconnection board comprises, as essential component, a phosphorus containing amorphous thermo-plastic resin containing polysulfone and polyethersulfone of weight- average molecular weight 103-105, phosphorus containing epoxy resin such as bisphenol type epoxy resin, novolak type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene epoxy resin of weight-average molecular weight 103-105, as well as multifunctional epoxy resin of epoxy equivalent 500 or less, epoxy curing agent, and phosphorus containing compound agent which does not contain halogen. Thus, fire-resistance and heat characteristics are improve. |
