| 摘要 |
PROBLEM TO BE SOLVED: To provide dielectric paste possible to be bake in a non-acid atmosphere and excellent in insulating characteristics after baking, and a multilayered base using it. SOLUTION: Dielectric paste is applied so as to cover a Cu wiring layer on a ceramic base. The dielectric paste contains an inorganic insulating material and both ethyl cellulose and acrylic as resins, and is made by dispersing them in an organic solvent. By adding both ethyl cellulose and acrylic to the dielectric paste this way, thermal decomposition of the resins added can be expedited while securing printing capability sufficient to suppress the occurrence of a pin hole, even in the case of baking in an atmosphere having no oxygen, and an insulating layer (dielectric layer) excellent in insulating characteristics can be formed. |
