发明名称 ELECTRONIC COMPONENT MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting method, whereby the unit time for mounting an electronic component can be reduced by quickly and high accurately detecting the electronic component vacuum-chucked to a holder. SOLUTION: This electronic component mounting method is for mounting an electronic component b on a board c, after photographing vacuum chucking information of the component b with continuously moving detecting means 12, composed of a line sensor-camera 16 in a process of moving a component b vacuum chucked with a holder 3 of a mounting head 2 to the board c. The image pickup of component b by the detecting means 12 is made with illumination by illuminating means 13, this illumination being controlled according to the electronic component b to be mounted on the board c.
申请公布号 JP2000277999(A) 申请公布日期 2000.10.06
申请号 JP19990085024 申请日期 1999.03.29
申请人 TENRYU TECHNICS CO LTD 发明人 OKAZAKI SHINICHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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