发明名称 SUBSTRATE PROCESSING METHOD AND PROCESSING SYSTEM THEREFOR
摘要 PROBLEM TO BE SOLVED: To prevent adhesion of the mist of processing liquid to a substrate when it is dried through spin system by performing a chemical processing process and a chemical drying process in same processing tank. SOLUTION: At first, spin system chemical cleaning process and rinsing process are performed by spin system in one spin cup 2 (Fig. a) and then spin system drying process is performed (Fig. b) after a substrate 5 is pushed up to be separated sufficiently from the upper edge of the spin cup 2. Since spin system drying process is performed at a position separated from the spin cup 2 being used for chemical cleaning process, re-adhesion of chemical mist to the substrate is prevented sufficiently and the number of residual particles on the substrate 5 can be decreased sufficiently.
申请公布号 JP2000274942(A) 申请公布日期 2000.10.06
申请号 JP19990073752 申请日期 1999.03.18
申请人 TOSHIBA CORP 发明人 OYAMA TAKESHI
分类号 B08B3/04;F26B5/08;G02F1/1333;(IPC1-7):F26B5/08;G02F1/133 主分类号 B08B3/04
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