发明名称 COOLING STRUCTURE FOR ELECTRONIC UNIT
摘要 PROBLEM TO BE SOLVED: To surely cool a mounted heat generating electronic component and to improve reliability and economy by improving air fluidity and air cooling efficiency in the fin of a heat sink. SOLUTION: In the cooling structure of an electronic unit, which circulates cooling air in a heat sink 4 and cools a heat generating part, an air guiding cover 18 where both end parts are bent in directions opposite from fins is fitted to the tips of fins 8 in the heat sink, and cooling air flowing in from one end of the air guiding cover is concentrated to a fin groove by the air guiding cover and it flows out from the other end of the air guiding cover through the fin groove.
申请公布号 JP2000277955(A) 申请公布日期 2000.10.06
申请号 JP19990085232 申请日期 1999.03.29
申请人 KOKUSAI ELECTRIC CO LTD 发明人 TAKAYASU TETSUFUMI;TAKAHASHI YOICHI;SHIRATORI MASUO
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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