| 摘要 |
PROBLEM TO BE SOLVED: To remove the residue of flux from the surface of a semiconductor chip and the surface of the wire bonding pad of a substrate. SOLUTION: First, a semiconductor chip 11, the surface of which is coated by a coating material CM, and a substrate 12 having the wire bonding pad 121 whose surface is coated by the coating material CM, are prepared, or the surface of the semiconductor chip 11 and the surface of the wire bonding pad 121 are coated using the coating material CM. Flux containing solder Swf is applied on the substrate 12. Then, an electronic part 10 and the semiconductor chip 11 are mounted on the substrate 12, they are put in a reflow furnace and the electronic part 10 and the semiconductor chip 11 are connected to the substrate 12. Then, the coating material CM is removed, and the electrode pad of the semiconductor chip 11 and the wire bonding pad 121 are connected by a metal wire W. |
