发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To reduce solder adhesion defects of an automatic soldering operation of a belt conveyor type. SOLUTION: The shape of a soldering part 1 on a printed wiring board 4 is made narrow as toward the downstream side of the flow of solder, and it is curved to be a tear-shaped bead shape. Thereby, as soon as the soldering part 1 is separated from a solder tank, solder which adheres in a comma-shaped bead shape is moved to the soldering part 1 as the lead leg of an electronic or electric component according to the principle of surface tension. As a result, the solder adhesion amount of the lead leg becomes much, and solder adhesion defects can be eliminated.
申请公布号 JP2000277894(A) 申请公布日期 2000.10.06
申请号 JP19990085831 申请日期 1999.03.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUDA AKIRA;MAKIDERA TAKAMICHI;FUJII YASUSHI;TOKUNAMI TAKAO
分类号 H05K3/34;H05K1/18;(IPC1-7):H05K3/34 主分类号 H05K3/34
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