| 摘要 |
PROBLEM TO BE SOLVED: To provide a pellet bonding device which is simple in structure, capable of detecting a wafer control indication, and improved in peripheral workability. SOLUTION: A pellet bonding device 10 is capable of detecting a wafer control indication N attached to a wafer, a wafer sheet, or a wafer ring by the use of a pellet position detecting camera 20 attached to a wafer stage 11.
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