| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a fine circuit board with satisfactory yield without generating disconnections, deformation or the like of a fine wiring pattern by a method, wherein a transfer medium in which a conductive layer is formed on the whole face of a substrate to be in a desired pattern and in which a conductive interconnection in a desired pattern is formed on the surface of the conductive layer is used and a transfer medium, in which at least a conductive interconnection and a substrate can be removed selectively by different etchants, is used. SOLUTION: A Zn-based conductive layer 103 is formed by an electroplating on the surface of an Al substrate 101. In addition, a desired pattern by a photosensitive resin 104 is formed on the surface of the conductive layer. A Cu conductive interconnection 105 is formed in a region, in which the surface of the conductive layer is exposed after the pattern is formed. The photosensitive resin is removed by an alkaline aqueous solution. Thereby, a transfer medium is manufactured. After the conductive interconnection of the transfer medium is buried in an insulating board, the conductive layer and the substrate are removed with hydrochloric acid, and a desired wiring pattern is obtained. |
