| 摘要 |
PROBLEM TO BE SOLVED: To allow easy and efficient pasting on the surface of a heating body by a constant film thickness, by sandwiching a silicone oil compound between first and second release sheets. SOLUTION: A heat dissipation material comprises an adhesive silicon oil compound 3 between first and second release sheets 1 and 2. Related to the silicone oil compound 3, a silicon oil is filled with a material excellent in heat- conductivity. Related to the first and second release sheets 1 and 2, high polymer water-absorptive material or water-retentive material holds water content. When in use, one of the first and second release sheets 1 and 2 is released, and the silicone oil compound 3 is pasted while pressed against the surface of a target heating body by a finger tip from the other second release sheet 2 or first release sheet 1. Thus, it is pasted by an even film-thickness even on the surface of a heating body such as CPU for a personal computer.
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