发明名称 ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic equipment, in which a metallic cover body can be joined firmly by forming sufficient brazing metallic filler bank at the junction of the metallic cover body, and an electronic component housed inside can be operated normally and stably over a long term. SOLUTION: An electronic component 4 is loaded inside a metallic frame body 2 mounted on the upper face of an insulating substrate 1, and a metallic cover body 3 is jointed via a brazing metallic filler 8 on the upper face of the metallic frame body 2 by seam welding, so that electronic equipment is constituted. The inner peripheral edge of a melting region W1 of the brazing metallic filler 8 through seam welding is isolated from the inner peripheral edge of the metallic frame body 2 by 0.05 mm or larger, and the outer peripheral part (bent part K) of the metallic cover body 3 is bent downward. Thus, the flow or spread of the brazing metallic filler can be prevented from generating in the container, and a sufficient brazing metallic filler bank is formed at the junction of the metallic cover body 3 so that the airtightness of the container becomes high.
申请公布号 JP2000277647(A) 申请公布日期 2000.10.06
申请号 JP19990082250 申请日期 1999.03.25
申请人 KYOCERA CORP 发明人 SUZUKI MAKI
分类号 H01L23/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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