| 摘要 |
PROBLEM TO BE SOLVED: To obtain a part bonding device which is capable of very accurately bonding a part to a mounting object at a prescribed position without being affected by the thermal expansion of the mounting object and simplified in structure. SOLUTION: A part bonding device is equipped with a heater 20 which heats a heat sink 16, a bumper 22 which is made to bear against the reference edge face 16a of the heat sink 16 so as to position an LD chip 12 and whose thermal expansion coefficient is lower than that of the heat sink 16, and a spring 24 which bears against the edge face 16b of the heat sink 16 to press the heat sink 16 against the bumper 22.
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