Chip card electronic chip module production method has pulverized material applied directly to dielectric support film to provide protective encapsulation film for each IC chip and its associated bonding wires

摘要

The production method has a pulverized protective material (50) applied directly to a dielectric support film (15) supporting a number of IC chips (10) coupled to respective contact pads (18) via bonding wires (17), so that a protective encapsulation film (51) is provided for each IC chip and its bonding wires. Also included are Independent claims for the following: (a) an electronic chip module; (b) a chip card.