Unit for treatment of articles, especially silicon wafers, stored in containers includes treatment gas supply device with pressure regulator, and continuous container purging device for gas flow rate control

摘要

Treatment gas supply device (14) has treatment gas pressure regulator (22) upstream of the containers (12). Device (16) for continuous purging of the containers (12) comprises a gas ejector (28) connected to the containers (12) and supplied by driving gas, to regulate treatment gas pressure downstream of the containers (12), and thus control gas flow rate in the containers (12). The gas ejector (28) constitutes a means of diluting the treatment gas. The flow rate of the driving gas constitutes a means of regulating the amount of treatment gas in the mixed gases coming out of the ejector (28). Preferably, the gas ejector (28) comprises two coaxial nozzles internally and externally supplied by the driving gas and the treatment gas, respectively, and the ratio of the areas of passage of the nozzles constitutes a means of pressure regulation downstream of the container (12). The treatment gas pressure regulator (22) is located between a treatment gas supply source (18) and the inlet to the container (12). Independent claims are given for: (i) an installation for storing silicon wafers; and (ii) a process for the treatment of articles stored in containers.