| 摘要 |
A substrate heating apparatus having a chamber (34), a device for adding gas into the chamber and a substrate heater is provided. The substrate heater is located within the chamber and includes a first plate (54) having a bottom surface. The bottom surface of the first plate has at least one groove. The at least one groove forms at least two thermal zones on the first plate. The substrate heater further includes a heater element (66) and a second plate (52). The heater element is located between the bottom surface of the first plate and the second plate and thus enables heating of the substrate by radiation and gas conduction.
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