METHOD FOR MANUFACTURING THREE-DIMENSIONAL PRINTED WIRING BOARD

摘要

A method for manufacturing a three-dimensional printed wiring board which comprises providing an insulating film comprising a thermoplastic resin composition comprising 65 to 35 wt. % of a polyarylketone resin such as a polyether ether ketone resin having a peak temperature for crystal melting of 260 DEG C or more and 35 to 65 wt. % of a non-crystalline polyether imide resin and having a glass transition temperature of 150 to 230 DEG C as measured during temperature rising according to the differential scanning calorimetry, laminating a conducting foil such as a surface roughened copper foil on one face or both the faces of the insulating film, allowing the film and the foil to undergo fusion bonding by thermal pressing in a manner such that the above thermoplastic resin composition satisfies the relationship represented by formula (I) between a heat of melting of crystal ( DELTA Hm) and a heat of crystallization ( DELTA Hc) generated by crystallization during temperature raising, forming a conductor circuit (2), and then carrying out a thermal press working using a convex mold plate (4) in a manner such that the thermoplastic resin composition satisfies the relationship represented by formula (II), to thereby manufacture a three-dimensional printed wiring board (7); Formula (I): [( DELTA Hm - DELTA Hc) / DELTA Hm] /= 0.7. The method can be used for manufacturing with good efficiency a three-dimensional printed wiring board which has a conductor foil having been bonded to a substrate at a low temperature with reliability and a three-dimensional form such as a convex or a concave form being precisely reproduced and is free from residual stress.