| 摘要 |
PURPOSE: A wire bonding tape and bonding method using the bonding tape is to electrically connect each pad of a chip and an inner lead at one time, thereby increasing a productivity. CONSTITUTION: A wire bonding tape, comprises a tape(1) comprised of an upper layer portion and a lower layer portion and having a through hole comprised of three holes as a unit to be formed in series at regular intervals, a plurality of gold ribbons for electrically connecting a bonding pad(300) at a center portion of a semiconductor chip(3) and a tip of an inner lead(11). A bonding method using the bonding tape comprises steps of positioning a lead frame on an upper face of a heater block(5) placed at a lower portion of a window clamp(4), feeding the wire bonding tape to an upper portion of the window clamp using a tension roller(6a,6b), aligning the gold ribbon, the semiconductor chip and the tip of the inner lead, attaching both ends of each gold ribbon to the bonding pad of the semiconductor chip and the tip of the inner lead using a bonding tool(12), and cutting a portion between the through holes. |
