| 摘要 |
PURPOSE: A method for manufacturing a PCB applied to a high frequency circuit for a mobile telecommunication station is provided to form a composite structure by using an adhesive having a low dielectric ratio. CONSTITUTION: Dielectric materials like TEFLON layer(100), FR-4 layer(200), and ceramic or aluminium layer(300) are arranged in horizontal direction on both sides of flexible PCB(600) respectively. They are adhered by the flexible PCB to form a sandwich type composite structure. They are also coated by a dielectric material like a copper coil. The adhesive may be replace to a prepreg layer or bonding film instead of the flexible PCB. If the prepreg layer is selected for the adhesive, the dielectric ratio should be within 3.2-7.7 F/m. In case of bonding film, it should be within 2.1-3.7 F/m.
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