RESIN/COPPER/METAL LAMINATE AND METHOD OF PRODUCING SAME

摘要

A laminate (120) for use in production of printed circuit boards comprising a metal foil (22) having a first side and a second side; a metallic substrate (24), one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate (122, 124) formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the metal foil, the adhesive substrate being at least partially uncured; and a releasable protective film (126) along the second surface of the adhesive substrate.