Method to apply sealant to electronic component uses contact part positioned in liquid sealant film and pressed against component

摘要

A contact part (4) is positioned in a film of liquid sealant (2) parallel and at a distance of approx. 0,05 to 5mm to its surface. The sealing surface (3a) of the component (3) is pressed against the contact part within the sealant, and the sealant is transmitted to the sealing surface by pulling the component away from the sealant. Contact part and sealant film are of approx. the same thickness. The contact part incorporates a mesh part.