| 摘要 |
<p>PURPOSE: A base of a plastic package and fabrication method thereof is to accomplish a miniaturizing technique such as leadless or bottom lead and various functional capabilities such as low noise or high heat radiation to a plastic package using a plastic molding technique. CONSTITUTION: A base of a plastic package comprises: a first lead frame including at least one unit body having a first pad(120) for chip bonding and a first lead(110a) arranged around the first pad and functioning as inner terminal apart from the first pad; a second lead frame including at least one unit body having a second pad(220) corresponding to the first pad and a second lead(210) corresponding to the first lead, the second pad and the second lead being attached to the rear surface of the first pad and the first lead; and a plastic body(320) exposing the front surfaces of the first lead and the first pad and the rear surface of the second lead and the second pad and molded between the first lead frame and the second lead frame such that the plastic body is not protruded upward from the front surface of the first lead.</p> |
