Substrate for a power semiconductor module in an electric vehicle has a buffer layer of intermediate thermal expansion coefficient interposed between an insulating substrate and a heat sink

摘要

A power module substrate comprises a buffer layer of intermediate thermal expansion coefficient interposed between an insulating substrate and a heat sink. A power module substrate has a buffer layer which is interposed between an insulating substrate and a heat sink and which has a surface area one to three times larger than that of the substrate. The buffer layer is formed of a material with a thermal expansion coefficient intermediate between those of the substrate and the heat sink.