| 摘要 |
PURPOSE: A slurry supplying method is to provide a slurry in which an abradant is distributed in an optimum dispersing state, thereby reducing a process inferiority generated in a semiconductor fabricating process. CONSTITUTION: A slurry supplying method comprises steps of adding a desired appendix to the slurry and diluting the slurry, dispersing the diluted slurry using a dispersing device so that particles of an abradant are optimally distributed in the diluted slurry, filtering the dispersed slurry using a desired filter so that the particles of the abradant have a desired size, and supplying the filtered slurry to a polishing device. In the method, the appendix is a dispersant for preventing a lumping phenomenon between deionized water and the abradant in the slurry and an agent for controlling a hydrogen ion exponent. The dispersing device is a mixer, a shaker, a sonicator, a rotor and stator, continuous type device.
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