| 摘要 |
<p>A method for establishing a thermal interface (1000) between an electrical component (200) and a heat sink (100) including the selection of a compound having a melt temperature above the normal operating temperature of the component (200). The electrical component (200) initially reaches an initial operating temperature sufficient to deform or melt the compound and fill the spaces between the mating surfaces (210, 110) of the component (200) and heat sink (100). Upon cooling, a solidified thermal joint (1000) is permanently established which precludes the component (200) from heating beyond its normal operating temperature upon subsequent operation. As the normal operating temperature of the component (200) is below the melt point of the compound, the compound remains in a solid state. The compound is selected so as to deform only during initial component (200) operation so as to avoid the problems of liquefaction. An alternative compound is selected with the above attributes along with desired adhesive characteristics to fix the component (200) to the heat sink (100) with the compound therebetween at low closure forces.</p> |
