Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board

摘要

The heat sink elements (15as,15bs,15c) are arranged in thermal contact with conductor strips arranged on the other side. The heat sink elements are marked soldered onto strips of conductor (14as,14bs,14c). The area of the housing (2) is filled partially with heat conductive and electrically insulating compound (6), in which the heat generating components are embedded completely. Heat sink elements are deposited as surface mounting device (SMD) components on the second side of the printed circuit board (3) and soldered in reflow soldering method with strip conductors on the second side.