| 摘要 |
PURPOSE: A reaction chamber and method for fabricating a semiconductor device is to allow a reflecting angle of a reflector for reflecting heat in the reaction chamber to be changed, thereby uniformly coating a film on a wafer. CONSTITUTION: A reaction chamber(100) for fabricating a semiconductor device comprises a wafer supporting portion, a heater(120) for radiating heat at a lower portion of the wafer supporting portion, and a reflector(150) for reflecting heat from the heater to supply the heat to an upper face of a wafer(130). The reflector is symmetric with respect to an axis so that left and right ends of the reflector are moved upward and downward. The axis is connected with a driving portion(160) for driving the reflector. A method for fabricating a semiconductor device using the reaction chamber comprises the steps of observing a thickness of a film coated on the wafer, and controlling an angle of the reflector so as for the film to be uniformly formed.
|
