| 摘要 |
PURPOSE: A socket for PLCC(Plastic Leaded Chip Carrier) type semiconductor package is provided to enable easy replacement of package in the case of failures by connecting the PLCC type semiconductor package to a substrate of an EDS(Electrical Die Sorting) apparatus via the socket. CONSTITUTION: A socket(10) is provided with an insertion groove(13) with a predetermined depth so that a PLCC type semiconductor chip package(30) can be inserted into the upper part of the socket body(11), and a through-hole(14) which is formed on the lower surface(18) to the insertion groove(13). By formation of the insertion groove(13), first inner surface(15) is formed and a package settling surface(16) is formed to have a step with a predetermined depth from the upper end. Also, second inner surface is formed from the formation of the insertion hole(14). A socket lead(12) is integrally formed along the first inner surface and the package settling surface, and the second inner surface of the socket body(11), and penetrated from the second inner surface with a height from the lower surface(18) to the outer surface of the socket body(11) to be projected outside. The socket lead(12) electrically connects a package lead(32) of the PLCC type semiconductor chip package(30) to a contact pad(51) of a substrate(50).
|
