| 摘要 |
PURPOSE: A lamination fixing method for a high multi-layered PCB is provided to prevent dislocation of printed circuit patterns or pin holes by preventing play of an adhering sheet. CONSTITUTION: A high multi-layer PCB is divided into upper and lower PCB layers(2,4) according to stacked number. Main rivet holes(7,8) are formed in the upper and lower PCB layers(2,4) and in insulating hot melt adhering sheet(5a,5b,6a,6b) in matching state. Around the main rivet holes(7a,7b,7c,7d,8a,8b,8c,8d) of the upper and lower PCB layers(2,4), first rivet holes(9a,9b,9c,9d) are formed alternatively to fix each of the upper and lower PCB layers(2,4) separately through the first rivet holes(9a,9b,9c,9d). The separately fixed upper and lower PCB layers(2,4) are stacked to be fixed through the main rivet holes.
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