| 摘要 |
<p>A method and apparatus for facilitating the removal and replacement of polishing pads utilized in the process of polishing and planarizing workpieces such as semiconductors where the polishing machine employed includes a rotatable platen. The apparatus (320) for facilitating the removal and replacement of polishing pads (326) includes a top plate (330) for securing a polishing pad (326) thereto and means for removably mounting the top plate (330) to the rotatable platen (328) in the polishing machine. Means for removably mounting the top plate (330) to the rotatable platen (328) preferably includes a plurality of electromagnetic elements (338) embedded within the top surface (336) of the rotatable platen (328) and means (340) for activating and deactivating the electromagnetic elements (338).</p> |
