METHOD FOR INDICATING MANUFACTURING NATION OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for indicating a manufacturing nation of a semiconductor package is to engrave a seal of indicating the manufacturing nation on an expose pad, thereby increasing a productivity and also a heat-radiating efficiency. CONSTITUTION: A method for indicating a manufacturing nation of a semiconductor package(1) including an expose pad(2) for discharging heat to an outside and a mold package(3) comprises a step of engraving a seal of indicating a manufacturing nation(4) on the expose pad instead of the mold package. The seal of indicating a manufacturing nation is engraved by corrosion or a press-punching way or silk printed on the expose pad. In case of the corrosion or press-punching way, a surface area of the expose pad on which the seal is engraved is increased to facilely radiate the heat.