A METHOD FOR REMOVING SURFACE CONTAMINANTS ON MOULDS USED IN SEMICONDUCTOR PACKAGING TOOLS
摘要
<p>The present invention utilizes laser to remove the surface contaminants such as grease, wax, and resin residue from a mould used in semiconductor packaging tools. The contaminant removal process utilizing the laser involves shooting a beam of laser onto the surface of the mould having the contaminants. The laser is delivered as a pulse which lasts only a short duration. Multiple pulses may be required to completely remove the contaminants. Because the area of coverage for each pulse is usually much smaller than the total area of the mould surface, the laser needs to be moved around until the entire mould surface has been exposed to the laser. Because fumes are produced as the laser disintegrates the contaminants, some type of vacuum should be used to remove the residual gas and other debris.</p>
申请公布号
EP1039977(A1)
申请公布日期
2000.10.04
申请号
EP19980936795
申请日期
1998.07.06
申请人
ADVANCED SYSTEMS AUTOMATION LIMITED;DATA STORAGE INSTITUTE
发明人
SONG, WENDONG;LU, YONGFENG;CHEN, QIONG;TAY, HUCK, WEE;HWA, TEIK, HING, THOMAS;LIM, LUI, CHING, DAWN;NGIN, JASON, YAN, KOON;SIM, JASON, YAK, HUI;GOW, CHENG, PAK