发明名称 |
PLASTIC COMPOSITE BODY |
摘要 |
<p>An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by a condensation process, which may be conductive or insulating. It is also possible to provide the chip with a sheathing which has such fillers.</p> |
申请公布号 |
EP1040519(A1) |
申请公布日期 |
2000.10.04 |
申请号 |
EP19980965611 |
申请日期 |
1998.12.14 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
ATZESDORFER, ALEXANDRA;NEU, ACHIM;JANCZEK, THIES |
分类号 |
C08L101/00;C08J5/12;C08K3/00;H01L21/52;H01L23/29;H01L23/31;H01L23/495;(IPC1-7):H01L23/29 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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