| 摘要 |
A fabrication method of fabricating an array of microstructures (8, 28, 48, 68, 108, 208) is provided. The method includes the step of preparing a substrate (1, 21, 41, 101, 201) with a surface including a usable region (5, 25, 45) and a dummy region (6, 26, 46, 66) continuously set around the usable region, at least the usable region and the dummy region of the substrate are electrically conductive and have a conductive portion (2, 22, 42, 102, 202). The method also includes the steps of forming a first insulating layer (3, 23, 43, 103, 203) on the conductive portion, and forming a plurality of openings (4, 24, 44, 104, 204) in the first insulating layer, the openings being arranged in a predetermined array pattern. Additionally, the method includes the step of performing one of electroplating and electrodeposition using the conductive portion as an electrode to form a first plated or electrodeposited layer (7, 27, 48, 68, 106, 206) in the openings and on the first insulating layer in both the usable region and the dummy region. <IMAGE> |
