| 发明名称 |
An image sensor ball grid array package and the fabrication thereof |
| 摘要 |
<p>The present invention is related to an image sensor packaging technique based on a Ball Grid Array (BGA) IC packaging technique, further referred to as image sensor ball grid array (ISBGA). A transparent cover is attached to a semiconductor substrate. Depending on the method of attaching the cover to the substrate a hermetic or non-hermitic sealing is obtained. The obtained structure can be connected trough wire-bonding or flip chip connection.</p> |
| 申请公布号 |
EP1041628(A2) |
申请公布日期 |
2000.10.04 |
| 申请号 |
EP20000201121 |
申请日期 |
2000.03.28 |
| 申请人 |
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW;CUSTOM SILICON CONFIGURATION SERVICES |
发明人 |
BEYNE, ERIC;LERNER, STEVE |
| 分类号 |
H01L23/12;H01L31/0203;H01L21/56;H01L21/60;H01L23/02;H01L23/498;H01L27/146;H01L31/02;(IPC1-7):H01L23/498;H01L31/020 |
主分类号 |
H01L23/12 |
| 代理机构 |
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