发明名称 |
Solder column tip compliancy modification for use in a BGA socket connector |
摘要 |
A socket connector system for forming a separable electrical contact between a first circuit substrate and a second circuit substrate. A dendrite interposer is disposed between the first circuit substrate and the second circuit substrate. A solder body is disposed between the first circuit substrate and the dendrite interposer. The solder body may include one of several types of solder columns or a solder ball. The solder body has a contact end which engages the dendrite interposer. The contact end has a void. An area of the contact end engages the dendrite interposer when compressive forces are exerted on the first circuit substrate and the second circuit substrate. This provides for all areas of a plurality of contact ends to engage and form reliable electrical contacts with the contact pads.
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申请公布号 |
US6126456(A) |
申请公布日期 |
2000.10.03 |
申请号 |
US19990400145 |
申请日期 |
1999.09.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL, JEFFREY S.;NESKY, ROBERT W. |
分类号 |
B23K1/00;B23K3/06;H01R12/00;H01R12/04;H05K3/32;H05K7/10;(IPC1-7):H01R12/00;H05K1/00 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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