发明名称 HOT RUNNER AND VALVE GATE MOLD, AND METHOD FOR PREVENTING SOLIDIFYING OF RESIN ON PERIPHERY OF GATE HOLE IN USING THE HOT RUNNER AND VALVE GATE MOLD
摘要 PROBLEM TO BE SOLVED: To prevent solidifying of a molten resin before closing a gate hole by a valve pin by providing a heater at a lower end portion of a center pin. SOLUTION: A heater 14 is provided at an axial center of a lower end of a center pin 12. The heater 14 is constituted to be heated by supplying a current from a power source through a cord 16 for the heater connected through the pin 12. A current amount from the power source to the heater 14 is controlled by a controller, and a heating temperature of the heater 14 is regulated in response to a type of a resin, a type of a mold or a surrounding environment to mold a product. The heater 14 is controlled to be heated during a forwarding step of a valve pin 13 from a valve open state. Here, the lower end of the pin 12 is heated from the previous step of filling a molten resin in a product molding portion, and the heat is transferred to a fixed pin 20 brought into contact with the pin 12. Thus, the molten resin can be prevented from being cooled on the way and early solidified.
申请公布号 JP2000271980(A) 申请公布日期 2000.10.03
申请号 JP19990077364 申请日期 1999.03.23
申请人 SEIKO EPSON CORP 发明人 OZAWA HIROSHI
分类号 B29C45/73;B29C33/02;B29C45/28;B29C45/30;B29C45/78;(IPC1-7):B29C45/73 主分类号 B29C45/73
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