| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor sealing epoxy resin composition excellent in fluidity and release properties at the time of molding and simultaneously excellent in soldering-resistant properties and high in reliability. SOLUTION: In the semiconductor sealing epoxy resin composition having, as the essential components, an epoxy resin, a phenolic resin, a curing accelerator, an inorganic filler, and a silane coupling agent, the weight of the carbon atoms derived from the coupling agent and fixed on the inorganic filler is 0.02-0.5 wt.% based on the inorganic filler. |
