发明名称 Wafer map analysis aid system, wafer map analyzing method and wafer processing method
摘要 In order to solve various problems of a wafer, two-dimensional analysis using a wafer map is aided. An image of the wafer map is classified and displayed on a screen for each item such as a manufacturing step, a device and inspection. A trend chart is also attached in addition to the image of the wafer map.
申请公布号 US6128403(A) 申请公布日期 2000.10.03
申请号 US19980026184 申请日期 1998.02.19
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OZAKI, HIROJI
分类号 G06K9/00;G06T7/00;H01L21/02;H01L21/66;(IPC1-7):G06K9/00 主分类号 G06K9/00
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