发明名称 |
Wafer map analysis aid system, wafer map analyzing method and wafer processing method |
摘要 |
In order to solve various problems of a wafer, two-dimensional analysis using a wafer map is aided. An image of the wafer map is classified and displayed on a screen for each item such as a manufacturing step, a device and inspection. A trend chart is also attached in addition to the image of the wafer map.
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申请公布号 |
US6128403(A) |
申请公布日期 |
2000.10.03 |
申请号 |
US19980026184 |
申请日期 |
1998.02.19 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OZAKI, HIROJI |
分类号 |
G06K9/00;G06T7/00;H01L21/02;H01L21/66;(IPC1-7):G06K9/00 |
主分类号 |
G06K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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