| 摘要 |
PROBLEM TO BE SOLVED: To provide cup-type plating equipment in which the inside of a plating tank is partitioned off with a diaphragm and the isolation of electrolytic solutions by means of a diaphragm is secured and plating treatment can be performed without causing mutual mixing of the isolated electrolytic solutions. SOLUTION: In the cup-type plating equipment, plating can be applied to a wafer 2 by feeding a plating solution to the wafer 2 which is placed on the opening of a plating tank 1 from a solution feed tube 3 provided to the central bottom of the plating tank 1 and also by polarizing an anode 5 provided inside the plating tank 1 and the wafer 2 connected to a cathode. Further, the anode 5 and the wafer 2 are isolated from each other by means of an electrically conductive diaphragm 6 provided inside the plating tank 1, and a wafer-side isolation chamber 8 and an anode-side isolation chamber 9 are formed. In this case, respective liquid pressures of the electrolytic solutions filling the wafer-side isolation chamber 8 and the anode-side isolation chamber 9, respectively, are detected, and respective liquid pressures of both isolation chambers 8, 9 are nearly equalized by liquid pressure control means.
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