| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition capable of suppressing an evaporated component generated by its heat decomposition without soiling a baking hearth, etc., by containing an epoxy resin and an epoxy resin heat decomposition-preventing agent. SOLUTION: This objective composition is obtained by containing (A) 100 pts.wt. epoxy resin and (B) 0.001-5 pt.wt. epoxy resin heat decomposition- preventing agent. It is preferable that the component A has <=10 ppm content of the component evaporated by its heating, and is a bisphenol A type epoxy resin containing <=10 ppm content of bisphenol A. Also, the component A has preferably >=170 epoxy equivalent. The composition preferably contains an epoxy resin-curing agent (e.g.; a polyamidepolyamine). As the blending method of the component B, it is preferable to add it to the component A after completion of the reaction of the epoxy resin or after melting the epoxy resin, and melt and mix at 50-250 deg.C for 30 min-5 hr.
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