WAFER HOLDING PLATE FOR WAFER POLISHING DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wafer holding plate for a wafer polishing device and manufacture thereof capable of efficiently obtaining a semiconductor wafer of high accuracy and high quality. SOLUTION: This wafer holding plate 6 is for slidingly contacting a semiconductor wafer 5 with a polishing surface of a table constituting the wafer polishing device. The semiconductor wafer 5 is adhered to a wafer adhesive surface 6a of the wafer holding plate 6 via an adhesive 8. The wafer adhesive surface 6a is a mirror finished surface having a groove pattern 10 for anchor.