| 摘要 |
<p>PURPOSE:To protect a mechanically fragile insulating board, where a semiconductor chip is mounted, safely from the pressure added to a metallic board doubling as its heat radiation board. CONSTITUTION:In a semiconductor device which is constituted by mounting an insulating board 2 mounting a semiconductor chip 1 on a metallic base board 3 doubling as a heat radiation plate and soldering it, and combining a resin case 4 and an external lead terminal 5 with it, and assembling them, the insulating board is protected from the cracks and break caused by stress by forming grooves 10 and 11 for absorption of stress at the places beside the area where the insulating board is soldered of the metallic base, and concentrating the stress added to the metallic base plate from outside in the groove sections so as to absorb it.</p> |
