发明名称 Photo-curable resin composition
摘要 A novel photo-curable resin composition. The resin composition capable of providing a cured product having excellent mechanical strength, high dimensional accuracy, and excellent toughness. The resin composition is capable of providing a cured product which experiences little change in mechanical strength over time. The resin composition is capable of forming, by photo-fabricating, a three-dimensional object which can be used for a long period of time in a humid atmosphere. The composition comprises, (A) an epoxy compound having a cyclohexene oxide, (B) a cationic photo-initiator, (C) an ethylenically unsaturated monomer, (D) a radical photo-initiator, and (E) a polyol.
申请公布号 US6127085(A) 申请公布日期 2000.10.03
申请号 US19970953633 申请日期 1997.10.17
申请人 DSM N.V.;JSR CORPORATION;JAPAN FINE COATINGS CO., LTD 发明人 YAMAMURA, TETSUYA;WATANABE, TSUYOSHI;TAKEUCHI, AKIRA;UKACHI, TAKASHI
分类号 G03F7/004;C08F2/50;C08L63/00;G03F7/00;G03F7/027;G03F7/028;G03F7/029;G03F7/038;(IPC1-7):G03F7/16 主分类号 G03F7/004
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