Method and apparatus for cooling hot-pressed panels, especially wood chip and fiber panels

摘要

A method of cooling hot-pressed panels, such as wood chip or fiber board panels or sheets, includes a first step in which the panels are intensively cooled from an initial temperature above 100 DEG C. down to a temperature of about 100 DEG C. by means of cooling water, a second step in which the panels are further cooled to a temperature below 60 DEG C. by using cooling air, and a third step of reconditioning the panels by exposing the panels to a vapor mixture of steam and volatile binder components that was evolved during the first step. The third reconditioning step can begin and take place already during the first cooling step, or between the first and second cooling steps. An apparatus for carrying out the method includes a hot press apparatus, a first cooling arrangement for applying cooling water to the panels, a second cooling arrangement for applying cooling air to the panels, a reconditioning zone for exposing the panels to a vapor mixture arising during the first cooling step, and a conveyor device for transporting the panels through the apparatus. In this manner, the total time required for cooling the panels is substantially reduced.