发明名称 |
POLYAMIDE RESIN COMPOSITION AND INJECTION MOLDED PRODUCT THEREFROM |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition giving molded products that have excellent appearance and high strength and rigidity and can obtain molded products having uniform hollow part length and the hollow thickness by the gas-assist injection molding. SOLUTION: This polyamide resin composition comprises (A) 30-70 pts.wt. of (A) a polyamide composition including (al) 50-100 wt.% of half-aromatic polyamide constituted with 70-95 wt.% of hexamethylene adipamide units from adipic acid and hexamethylenediamine, and 5-30 wt.% of hexamethylene isophthalamide units from isophthalic acid and hexamethylenediamine and (a2) 0-50 wt.% of aliphatic polyamide where the crystallization temperature is <=210 deg.C, 10-60 pts.wt. of (B) glass fiber with an average fiber diameter of 15-30μm and 10-60 pts.wt. of (C) inorganic fillers other than glass fibers. |
申请公布号 |
JP2000273300(A) |
申请公布日期 |
2000.10.03 |
申请号 |
JP19990079373 |
申请日期 |
1999.03.24 |
申请人 |
ASAHI CHEM IND CO LTD |
发明人 |
WATANABE HARUMI;NISHIOBINO KATSUIE |
分类号 |
B29C45/00;B29K77/00;B29L22/00;C08K3/00;C08K7/14;C08L77/00;(IPC1-7):C08L77/00 |
主分类号 |
B29C45/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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